Tempat asal
Guangdong, China
Tembaga ketebalan
17um-35um
Finishing permukaan
Immersion Tin / Immersion Ni / Au / Plated Ni/Au
Line Width Control Tolerance
≤4milLine:±0.015mm (±0.0006")>4milLine:±10%
Min.Line Width
0.035mm(0.0014")
Layer to Layer Registration
±0.038mm(±0.0015")
Min.Solder Mask Dam
0.05mm(0.0020")
Solder Mask Registration
±0.02mm(±0.0008")
Min.SMT/QFP Pad Pitch
0.250mm(0.0100")
Min.BGA Pad Pitch
0.30mm(0.0118")
Max.Board/Array Size (Universal ET)
2L:2000mm*500mm (78.7402"*19.6850")≥4L:1150mm*430mm (45.2755"*16.93")
HDI Structure
ELIC(2-8step)
Impedance Control Tolerance
±8%