Aplikasi
Industrial Ceramic
Pengolahan Layanan
Moulding
Flexural Strength, MOR (20 °C)
300 - 460 MPa
Fracture Toughness, KIc
2.75 - 6.0 MPa m1/2
Thermal Conductivity (20 °C)
80 - 100 W/m K
Coefficient of Thermal Expansion
3.3 - 5.5 1 x 10-6/°C
Maximum Use Temperature
800°C
Dielectric Strength (6.35mm)
16.0 - 19.7 ac-kV/mm
Dielectric Loss (tan)
1 x 10-4 to 5 x 10-4
Volume Resistivity (25°C)
1013 to 1014 ( Ω-cm )