Tempat asal
Guangdong, China
Penggunaan
Konstruksi, CMOS and other temperature sensitive devices are bonded
Klasifikasi
Perekat Lainnya
Product name
Low temperature epoxy adhesive
Characteristic
With any temperature and thermal treatment, matt excellent adhesion
Curing conditions
5-10min@80°C
Application
CMOS and other temperature sensitive devices are bonded